product_capabilities Archives -

Specifications

Category	Capability	Details
PCB Material Brand	Goldenmax GL11,Guangzhou Aluminum	(Goldenmax GL11,Guangzhou Aluminum)
SolderMask	LB Brand	LB-1900W
Copper Thickness	18um/25um/35um/70um（0.5oz/0.75oz/1oz/2oz）	Refers to the thickness of finished PCB outer copper，0.5oz=18um，1oz＝35um
PCB Thickness	0.8-2.0mm	0.8/1.0/1.2/1.6/2.0 mm
Thickness Tolerance( thickness≥1.0mm)	≤10	Thickness measurement position is the thickest position of the whole PCB (including copper + Soldermask + Silkscreen)
PCB Thickness Tolerance (Thickness <1.0mm)	±0.1mm	Thickness measurement position is the thickest position of the whole PCB (including copper + Soldermask + Silkscreen)
Minimum Trace Width	≤10	At present,we can process min 8mil trace width,and ≥10mil is advised
Minimum Trace Distance	8mil（0.2mm）	At present,we can process min 8mil trace distance,and ≥10mil is advised
Drilling Aperture	Hole size≥ PCB thickness ≥1.0mm	The minimum hole shall not be less than the thickness of the PCB, and it shall not be less than 1.0mm
Drilling Hole Tolerance	±0.1mm	Hole tolerance is ±0.1mm, for example, designed for 1.5mm hole, the drilling hole of the final PCB in 1.4-1.6mm is normal.
Soldermask Type	Photosensitive ink	Photosensitive ink is now the most used type, thermosetting oil is generally used in low-grade light panels
Soldermask Bridge	0.15mm	If the soldmask color is green or blue, the pad spacing must be bigger than or equal to 8mil; White and black ink pad spacing ≥10mil
Minimum Silkscreen Width	≥0.15mm	Minimum width of characters is 0.15mm, if less than 0.15mm, the physical board may cause unclear characters due to design reasons.
Minimum Silkscreen Height	≥1.0mm	Minimum height of characters is 0.8mm. If the height is less than 0.8mm, the characters may be unclear due to design reasons
Max Size	Standard：480x580mm Max：580x1180mm	The limit size is the maximum size that can be machined, but the cost will increase due to plate waste and high processing costs
Dimension Accuracy	±0.15mm	CNC contour tolerance is ±0.15mm, V-Cut contour tolerance is ±0.15mm, mold shaping contour tolerance is ±0.1mm
Panel: no gap between the panel	0mm	The gap between the PCBs is 0mm
Panel: there are gaps between the panel	2.0mm	If you want space between each PCB while panelling, the distance should be bigger than 2.0mm.

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PCB Assembly Capabilities Overview

Category		Details
Lead Time		1. Regular prototyping orders can be finished in 1-2 days 2. Small batches take 3 days (expedited service available in 24 hours) 3. Medium batches will take 5 days or more, scheduled delivery is recommended for long-term demands Remark: Lead time will be calculated after PCB, components, and necessary documents are ready (BOM, CAD, Gerber file, and other design drawings, etc.)
PCBA SMT+DIP Equipments		1. Seven Siemens high-speed and high-accuracy SMT production lines 2. Three DIP production lines (automatic wave-soldering)+ 2 manual soldering lines 3. Three Assembly and testing lines
PCBA Capacity		SMT Capacity: 10 million points per day DIP Capacity: 180,000 points per day 30-50 different designs per day (single shift)
Components Service	Turnkey	AIVON has established a complete and reliable supplier network, which enables us to get qualified components at reasonable prices
	Kitted or Consigned	Customers provide all components, and we do the assembly work To ensure the PCBA quality, all components shall be packaged in tube, tape, tray or reel to suit our assembly machine
	Partial Turnkey	Customers provide the major components and we buy the rest
PCBA Solder Type		SMT, THT, single or double side PnP
Solder Paste/Tin Wire/Tin Bar		Both lead and lead-free (RoHS compliant) are available
Stencil		High-accuracy laser cutting stencil to ensure good printing performance such as Fine-pitch ICs and BGA to meet IPC-2 Class or higher
MOQ		no MOQ required for customers with R&D purposes
Component Size	Minimum Package	01005 chip size
	Minimum BGA Spacing	0.3mm(ball to ball)
	Minimum Fine Pitch	0.25mm (X-ray available to ensure the solder quality)
Component Package		We accept tape and reel, tube, and tray packages for components
Maximum Mount Accuracy of Components (100FP)		±50 μm
Solderable PCB Type		Rigid PCB, FPC, Rigid-Flex PCB, Aluminum PCB
PCB Size		Min PCB size：50mm x 50mm （boards under this size will be panelized） Max PCB size：350mm x 1200mm
Testing and coverage		We will apply a variety of testing to the PCBA in mount or already mount to ensure the quality before shipping
	IQC: incoming inspection	Reject the defective material to avoid loss in the production line
	SPI: solder paste inspection	1. Real-time monitoring of Height/Area/Volume of solder paste 2. Capture the defect of the solder bridge, insufficient or excessive solder, and poor shape of the solder
	Online AOI inspection	1. Inspect the soldering performance of all parts, also include the polarity of components 2. 3D AOI can catch the defect of tiny lift of QFP pins
	SMT sample inspection	FAI check refers to the BOM and Gerber data, to make sure all the components are correctly mounted, and prevent defects from getting into the next process
	IPQC inspection	In-process inspection and verification of SMT&DIP production system, double check for each process
	Offline AOI inspection	Inspect for defects such as wrong parts, parts missing, and wrong polarity
	X-Ray inspection	Inspect the solder joint of BGA, QFN, and other high-precision components which are invisible to human-eye
	Functional Testing	1. The customer provides the test program and test method, we can follow up 2. Highly recommend customers conduct functional tests (especially for massive products) before shipping to prevent any defects
Repair & Rework		We offer repair services for any soldering defects

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Specifications

Category		Small and Medium Batches Order (Order area ≥10㎡)	Prototype Order (Order area < 3㎡)
Product structure		1+n+1; 1+1+n+1+1; 2+n+2	1+n+1; 1+1+n+1+1; 2+n+2
Product structure		F+R, cu+F+cu, R+F+R+F+R, R+F+R	F+R, cu+F+cu, R+F+R+F+R, R+F+R
Number of layers	Rigid-flex PCB	≤18L	≤24L
Number of layers	FPC	≤10L	≤16L
Board thickness (mm)	Rigid-flex board	0.3-3.2	0.3-3.2
Board thickness (mm)	FPC	0.06-0.35	0.06-0.35
Board size (mm)	Rigid-flex PCB	1515 to 310510	1515 to 310510
Board size (mm)	FPC	515 to 310510	515 to 310510
Copper thickness (OZ)	Maximum copper thickness of FR-4	Outer layer 2OZ, inner layer 2OZ	Outer layer 2OZ, inner layer 2OZ
Copper thickness (OZ)	Maximum copper thickness of FPC	Outer layer 1 OZ, inner layer 1 OZ	Outer layer 2 OZ, inner layer 2 OZ
Minimum copper trace width and spacing capability (um)		75/75	75/75
Minimum diameter of mechanical drill (mm)		0.2	0.15
Rigid part material	Tg170	S1000-2M,IT180A	S1000-2M,IT180A
	High TG halogen-free	S1165	S1165
	Thickness of dielectric layer (mm)	0.1-3.2	0.075-3.2
Flex part material	Flexible material	PI DuPont, Panasonic, Shengyi	PI DuPont, Panasonic, Shengyi
	Surface insulation layer	Cover film, soldermask	Cover film, soldermask
	Thickness of dielectric layer (mm)	0.025-0.1	0.012-0.1
Surface treatment	Rigid-flex board	HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger , immersion gold + OSP	HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger , immersion gold + OSP
Surface treatment	FPC	FPC	HASL with lead / lead-free, immersion gold, OSP

Stack Up

4 conductive layers RFPC

1.0mm
1.6mm

	Rigid part		Flex part
	top soldermask layer	20um
rigid-top copper layer	Copper	18um(Finished Copper thickness 35um)
	FR4	400um	PI	12.5um
	Pure gum	13um	Adhesive	15um
flex-copper 2 layer	Copper	18um	Copper	18um
	Adhesive	20um	Adhesive	20um
	PI	25um	PI	25um
	Adhesive	20um	Adhesive	20um
flex-copper 3 layer	Copper	18um	Copper	18um
	Pure gum	13um	Adhesive	15um
	FR4	400um	PI	12.5um
rigid-bottom copper layer	Copper	18um(Finished Copper thickness 35um)
	bottom soldermask layer	20um
	Total thickness	1003um	FPC Thickness	156um

	Rigid part		Flex part
	top soldermask layer	20um
rigid-top copper layer	Copper	18um(Finished Copper thickness 35um)
	FR4	700um	PI	12.5um
	Pure gum	13um	Adhesive	15um
flex-copper 2 layer	Copper	18um	Copper	18um
	Adhesive	13um	Adhesive	13um
	PI	25um	PI	25um
	Adhesive	13um	Adhesive	13um
flex-copper 3 layer	Copper	18um	Copper	18um
	Pure gum	13um	Adhesive	15um
	FR4	700um	PI	12.5um
rigid-bottom copper layer	Copper	18um(Finished Copper thickness 35um)
	bottom soldermask layer	20um
	Total thickness	1589um	FPC Thickness	142um

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Specifications

Category	Capability	Details
Board Size	Min（pcs）	1*0.5mm
Board Size	Max (Pnl Size)	250*1200mm
Base Material Thickness		0.06——0.3mm
Board Thickness		0.1-0.5mm
Base Copper Thickness		1/3OZ——2OZ
PTH Hole Wall Copper Thickness		8-20μm
Blind Hole Filling Capacity Aspect Ratio (Hole Size: Hole Depth)		01:10:00
Blind Hole Filling Capacity (Hole Size)		50-150μm
Single Line Impedance Tolerance		≤10
Differential Impedance Tolerance		≤10
Min Track/Spacing (Double Layers Board)	Surface Copper Thickness：8-14μm	40/40 um
	Surface Copper Thickness：15-20μm	45/45 um
	Surface Copper Thickness：21-30μm	55/55 um
	Surface Copper Thickness：31-40μm	75/75 um
	Surface Copper Thickness：≥40μm	80/80 um
Line Width Tolerance	Line Width≤0.050mm	±.02mm
	0.05mm＜Line Width≤0.15mm	±20°
	Line Width＞0.150mm	≤10
Silkscreen	Silkscreen Character Min Width/Spacing	4mil
Cell_SolderMask	Green Solder Mask Thickness Range	10~30 μm
Related Capacity	Dimension Tolerance from Line Edge to Plate Edge	±0.25 mm

Stack Up

1 conductive layer FPC

0.08mm
0.1mm
0.13mm
0.15mm

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	18um(Finished Copper thickness 18um)
	Adhesive	13um
	PI	25um
Total thickness		83.5um

top coverlay	PI	25um
top coverlay	Adhesive	25um
top copper layer	Copper	18um(Finished Copper thickness 18um)
	Adhesive	13um
	PI	25um
Total thickness		106um

top coverlay	PI	25um
top coverlay	Adhesive	25um
top copper layer	Copper	35um(Finished Copper thickness 35um)
	Adhesive	20um
	PI	25um
Total thickness		130um

top coverlay	PI	25um
top coverlay	Adhesive	25um
top copper layer	Copper	70um(Finished Copper thickness 70um)
	Adhesive	0um
	PI	25um
Total thickness		145um

2 conductive layers FPC

0.1mm
0.13mm
0.15mm
0.18mm
0.2mm
0.23mm
0.26mm

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	12um(Finished Copper thickness 18um)
	Adhesive	0um
	PI	25um
	Adhesive	0um
bottom copper layer	Copper	12um(Finished Copper thickness 18um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		104um

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	18um(Finished Copper thickness 35um)
	Adhesive	13um
	PI	12.5um
	Adhesive	13um
bottom copper layer	Copper	18um(Finished Copper thickness 35um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		129.5um

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	18um(Finished Copper thickness 35um)
	Adhesive	20um
	PI	25um
	Adhesive	20um
bottom copper layer	Copper	18um(Finished Copper thickness 35um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		156um

top coverlay	PI	25um
top coverlay	Adhesive	25um
top copper layer	Copper	18um(Finished Copper thickness 35um)
	Adhesive	13um
	PI	25um
	Adhesive	13um
bottom copper layer	Copper	18um(Finished Copper thickness 35um)
bottom coverlay	Adhesive	25um
bottom coverlay	PI	25um
Total thickness		187um

top coverlay	PI	25um
top coverlay	Adhesive	25um
top copper layer	Copper	18um(Finished Copper thickness 35um)
	Adhesive	20um
	PI	25um
	Adhesive	20um
bottom copper layer	Copper	18um(Finished Copper thickness 35um)
bottom coverlay	Adhesive	25um
bottom coverlay	PI	25um
Total thickness		201um

top coverlay	PI	25um
top coverlay	Adhesive	25um
top copper layer	Copper	35um(Finished Copper thickness 50um)
	Adhesive	20um
	PI	25um
	Adhesive	20um
bottom copper layer	Copper	35um(Finished Copper thickness 50um)
bottom coverlay	Adhesive	25um
bottom coverlay	PI	25um
Total thickness		235um

top coverlay	PI	25um
top coverlay	Adhesive	25um
top copper layer	Copper	70um(Finished Copper thickness 70um)
	Adhesive	0um
	PI	25um
	Adhesive	0um
bottom copper layer	Copper	70um(Finished Copper thickness 70um)
bottom coverlay	Adhesive	25um
bottom coverlay	PI	25um
Total thickness		265um

4 conductive layers FPC

0.2mm
0.23mm
0.26mm
0.3mm
0.35mm

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	12um(Finished Copper thickness 18um)
	Adhesive	0um
	PI	25um
	Pure gum	13um
copper 2 layer	Copper	12um
	Adhesive	0um
	PI	25um
	Adhesive	0um
copper 3 layer	Copper	12um
	Pure gum	13um
	PI	25um
	Adhesive	0um
bottom copper layer	Copper	12um(Finished Copper thickness 18um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		204um

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	12um(Finished Copper thickness 18um)
	Adhesive	0um
	PI	25um
	Pure gum	13um
copper 2 layer	Copper	18um
	Adhesive	13um
	PI	12.5um
	Adhesive	13um
copper 3 layer	Copper	18um
	Pure gum	13um
	PI	25um
	Adhesive	0um
bottom copper layer	Copper	12um(Finished Copper thickness 18um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		229.5um

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	18um(Finished Copper thickness 35um)
	Adhesive	13um
	PI	25um
	Pure gum	13um
copper 2 layer	Copper	18um
	Adhesive	13um
	PI	12.5um
	Adhesive	13um
copper 3 layer	Copper	18um
	Pure gum	13um
	PI	25um
	Adhesive	13um
bottom copper layer	Copper	18um(Finished Copper thickness 35um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		267.5um

top coverlay	PI	25um
top coverlay	Adhesive	25um
top copper layer	Copper	18um(Finished Copper thickness 35um)
	Adhesive	13um
	PI	25um
	Pure gum	13um
copper 2 layer	Copper	18um
	Adhesive	0um
	PI	25um
	Adhesive	0um
copper 3 layer	Copper	18um
	Pure gum	13um
	PI	25um
	Adhesive	13um
bottom copper layer	Copper	18um(Finished Copper thickness 35um)
bottom coverlay	Adhesive	25um
bottom coverlay	PI	25um
Total thickness		299um

top coverlay	PI	25um
top coverlay	Adhesive	25um
top copper layer	Copper	18um(Finished Copper thickness 35um)
	Adhesive	13um
	PI	25um
	Pure gum	25um
copper 2 layer	Copper	18um
	Adhesive	13um
	PI	25um
	Adhesive	13um
copper 3 layer	Copper	18um
	Pure gum	25um
	PI	25um
	Adhesive	13um
bottom copper layer	Copper	18um(Finished Copper thickness 35um)
bottom coverlay	Adhesive	25um
bottom coverlay	PI	25um
Total thickness		349um

6 conductive layers FPC

0.3mm
0.37mm

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	12um(Finished Copper thickness 18um)
	Adhesive	0um
	PI	25um
	Pure gum	13um
copper 2 layer	Copper	12um
	Adhesive	0um
	PI	25um
	Adhesive	0um
copper 3 layer	Copper	12um
	Pure gum	13um
	Coverlay	27.5um
copper 4 layer	Copper	12um
	Adhesive	0um
	PI	25um
	Adhesive	0um
copper 5 layer	Copper	12um
	Pure gum	13um
	PI	25um
	Adhesive	0um
bottom copper layer	Copper	12um(Finished Copper thickness 18um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		293.5um

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Cooper	12um(Finished cooper thickness 18um)
	Adhesive	13um
	PI	25um
	Pure gum	13um
copper 2 layer	Cooper	12um
	Adhesive	13um
	PI	25um
	Adhesive	13um
copper 3 layer	Cooper	12um
	Pure gum	13um
	Coverlay	27.5um
copper 4 layer	Cooper	12um
	Adhesive	13um
	PI	25um
	Adhesive	13um
copper 5 layer	Cooper	12um
	Pure gum	13um
	PI	25um
	Adhesive	13um
bottom copper layer	Cooper	12um(Finished cooper thickness 18um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		371.5um

8 conductive layers FPC

0.38mm
0.48mm

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	12um(Finished Copper thickness 18um)
	Adhesive	0um
	PI	25um
	Pure gum	13um
copper 2 layer	Copper	12um
	Adhesive	0um
	PI	25um
	Adhesive	0um
copper 3 layer	Copper	12um
	Pure gum	13um
	Coverlay	27.5um
copper 4 layer	Copper	12um
	Adhesive	0um
	PI	25um
	Adhesive	0um
copper 5 layer	Copper	12um
	Pure gum	13um
	Coverlay	27.5um
copper 6 layer	Copper	12um
	Adhesive	0um
	PI	25um
	Adhesive	0um
copper 7 layer	Copper	12um
	Pure gum	13um
	PI	25um
	Adhesive	0um
bottom copper layer	Copper	12um(Finished Copper thickness 18um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		383um

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Cooper	12um(Finished cooper thickness 18um)
	Adhesive	13um
	PI	25um
	Pure gum	13um
copper 2 layer	Cooper	12um
	Adhesive	13um
	PI	25um
	Adhesive	13um
copper 3 layer	Cooper	12um
	Pure gum	13um
	Coverlay	27.5um
copper 4 layer	Cooper	12um
	Adhesive	13um
	PI	25um
	Adhesive	13um
copper 5 layer	Cooper	12um
	Pure gum	13um
	Coverlay	27.5um
copper 6 layer	Cooper	12um
	Adhesive	13um
	PI	25um
	Adhesive	13um
copper 7 layer	Cooper	12um
	Pure gum	13um
	PI	25um
	Adhesive	13um
bottom copper layer	Cooper	12um(Finished cooper thickness 18um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		487um

Drilling & Hole

Category	Capability	Details
Width Tolerance of White Line	Smooth Place	±0.10 mm
Width Tolerance of White Line	Bump Place	±0.20 mm
Min Drilling Hole Size	Machine Dril	0.100 mm
Min Punching Hole Size	N/A	0.50 mm
Complete Hole Size Tolerances	PTH	±0.050 mm
Complete Hole Size Tolerances	NPTH	±0.025 mm

Surface Treatment

Category	Capability	Details
Nickel Gold Plating	Nickel Thickness	40~ 314U"
	Nickel Th	±78U"
	Gold Thickness	1.18U" ~ 40U"
	Min Spacing (Golden Finger or Pad)	35um
Nickel Gold Immersion	Nickel Thickness	40 ~ 236 U"
	Nickel Th	±40U"
	Gold Thickness	1U" ~ 3 U"
	Min Spacing (Golden Finger or Pad)	40um
OSP	OSP Thicknes	6U"~20U"

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HDI Manufacturing Capabilities

Item	Category		Capability Parameters
Item	Category		Standard Capability	Sample Capability
Product Type	Any-layer Interconnect	/	yes	yes
	HDI Structure	/	3+N+3	6+N+6
	Layer Count	/	16 layers	20 layers
	Surface Finish	/	HASL (Leaded/Lead-free), ENIG, OSP, Bare Copper, Immersion Tin, Immersion Silver, ENIG + Gold Plated Fingers, HASL + Gold Plated Fingers, ENIG + OSP
	Special Process Boards	/	Half-holes, Resin Plugging, Countersink Holes, Step Slots, Depth-controlled Slots, Back-drilling, Embedded Resistors, Embedded Capacitors, Embedded Copper Blocks, Metal Edge Plating, Laser-engraved QR Codes
	Base Material	Material Type	FR-4 (Halogenated & Halogen-free), High-frequency, High-speed Materials
	Base Material	Material Suppliers	Kingboard, Nan Ya, Shengyi, ITEQ, Rogers, Panasonic, Arlon, Isola
Board Thickness	Max. Production Thickness	/	3.2mm	3.2mm
	Min. Production Thickness	/	0.3mm	0.2mm
	Thickness Tolerance	Thickness < 0.5mm	± 0.05mm	± 0.04mm
		0.5mm ≤ Thickness < 0.8mm	±10%	±10%
		0.8mm ≤ Thickness ≤ 1.0mm	± 0.08mm	± 0.08mm
		1.0mm < Thickness ≤ 1.6mm	±0.1mm	±0.1mm
		1.6mm < Thickness ≤ 2.3mm	±0.16mm	±0.13mm
Copper Thickness	Max. Inner Layer Copper	/	3OZ	5OZ
Copper Thickness	Max. Outer Layer Copper	/	4OZ	6OZ
Lamination	Layer-to-layer Registration	/	Max. Misalignment ≤ 50um	Max. Misalignment ≤ 50um
	Copper Foil Thickness	/	1/3oz, 1/2oz, 1oz, 1.5oz, 2.0oz	2.5oz, 3oz
	Common PP Lamination Capability	/	7628/2116/1080/106/3313/1067	1027/1017/1037 (IC Substrate Only)
	PP Dielectric Thickness Tolerance After Lamination	7628	±10%	/
		2116	±10%	/
		1080	±10%	/
		3313	±10%	/
		106	±10%	/
		1067	±10%	/
		1037	±15%	/
		1027	±15%	/
		1017	±15%	/
Laser Drilling	Hole Position Accuracy	/	≤10um	/
	Min. Blind Via Diameter	/	70um	60um
	Drillable Hole Diameter (Surface Cu 9um, Aspect Ratio ≤ 1:1)	Hole Diameter	PP Type	Min. Pad Size
		60um	1017/1027/1037	110um
		70um	1017/1027/1037/106/1067	120um
		80um	1017/1027/1037/106/1067	130um
		90um	1027/1037/106/1067	140um
		100um	106/1067/1078/1080	150um
		110um	106/1067/1078/1080	160um
		120um	106/1067/1078/1080/106+106	170um
		150um	1080/106+106/1080+106/1080+1080	200um
	Open-window Blind Vias (Surface Cu ≥ 13um, Aspect Ratio ≤ 1:1)	60–150um	Refer to Brown-oxide Blind Vias	Refer to Brown-oxide Blind Vias
		151–300um	Single layer ≤ 2116; multi-layer stack each layer ≤ 1080	/
		> 300um	Single layer ≤ 2116; multi-layer stack each layer ≤ 1080	/
Mechanical Drilling	Hole Diameter	Min. Single Round Hole Diameter	0.15mm	0.1mm
		Max. Single Round Hole Diameter	6.5mm	6.5mm
		Min. Slot Drill Diameter	0.5mm	0.4mm
		Inner Corner Radius of Square Slot	0.4mm	0.4mm
	Hole Diameter Tolerance	Single Round NPTH Hole	±50um	±38um
		Single Round PTH Hole	±76um	±50um
		Reamed Round Hole (NPTH)	±76um	±76um
		Reamed Round Hole (PTH)	±100um	±76um
		Countersink Hole Diameter (at Opening)	±152um	±127um
		Slot Width (PTH)	±76um	±50um
		Slot Width (NPTH)	±50um	±38um
	Slot Length Tolerance	Long Slot (Length ≥ 2× Width)	±76um	±76um
	Slot Length Tolerance	Short Slot (Length < 2× Width)	±4mil	±76um
	Hole Position Accuracy	1st Drill Position Accuracy	±76um	±50um
	Hole Position Accuracy	2nd Drill Position Accuracy	±76um	±50um
	Hole Edge-to-edge Spacing	Different Nets	≥254um	254um > L ≥ 200um (Use CAF-resistant Material)
	Hole Edge-to-edge Spacing	Same Net	≥200um	200um > L ≥ 152um (Note near-hole in MI, add dust-extraction re-drill)
	Slot Length Tolerance	Long Slot (Length ≥ 2× Slot Width)	±76um	±76um
	Slot Length Tolerance	Short Slot (Length < 2× Slot Width)	±100um	±76um
	Back-drilling	Depth Tolerance	±100um	±76um
	Countersink Hole	Angle	90º, 135º, 165º	90º, 135º, 165º
Electroplating	Horizontal Electroless Copper	Production Thickness Range	0.05-3.5mm	/
		Blind Via Diameter / Aspect Ratio	60-200um / 0.8:1 (Blind via count ≤ 4 million, Mini-LED)	1:1
		Min. Hole Diameter / Aspect Ratio	0.2mm hole / 8:1	10:1
		Min. Hole Diameter / Aspect Ratio	0.1mm hole / 5:1	8:1
	Via-filling VCP	Production Thickness Range	0.05-3.5mm	/
		Through-hole Aspect Ratio	8:1 (Hole Dia. 0.1mm)	/
		Throwing Power	TP ≥ 70% (Aspect Ratio ≤ 5:1)	/
		Throwing Power	TP ≥ 50% (Aspect Ratio ≤ 8:1)	/
		Surface Copper Standard Deviation	4um	/
		Blind Via Aspect Ratio	0.8:1 (60-200um)	1:1
	Through-hole VCP	Production Thickness Range	0.3-3.5mm	/
		Aspect Ratio	8:1 (Through-hole Dia. 0.1mm)	/
		Throwing Power	TP ≥ 80% (Aspect Ratio ≤ 6:1)	/
		Throwing Power	TP ≥ 68% (Aspect Ratio ≤ 8:1)	/
Resin Plugging	Production Thickness Capability	Minimum	0.3mm	0.2mm
	Production Thickness Capability	Maximum	3.0mm	3.2mm
	Vacuum Plugging	Plugging Fullness	≥95%	≥100%
		Plugging Hole Diameter (Drill Bit)	0.15-0.55mm	0.1-0.6mm
		Plugging Aspect Ratio	≦12:1	≦14:1
		Plugging Hole Spacing	≥0.5mm	/
	Grinding	Copper Removal by Grinding	Surface Cu: 3-4um; Hole Edge: 3-7um (Dia. ≥ 2.5mm)	/

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PCB Specifications

Item Content	Advanced	Description
Layer Count	Through-Hole board: 1~68-layer HDI: (8+N+8)	The number of copper layers
Overall Board Thickness (L)	0.2-10mm
Board Thickness Tolerance (l)	D<1.0mm: ±0.1mm D≥1.0mm: ±10%	For example, for a nominal board thickness of 1.6 mm, the finished board thickness tolerance ranges from 1.44 mm (T‑1.6×10%) to 1.76 mm (T+1.6×10%).
Max. Dimensions	1400 X 610mm	① These limits apply to PCBs with thickness ≥ 0.8 mm. For thinner boards, the maximum dimension is ≤ 510 × 410 mm. ② Max dimension for 2‑layer: ≤ 530 × 700 mm; 4‑layer: ≤ 490 × 590 mm; 6‑layer and above: ≤ 490 × 590 mm. ③ A technical review is required for sizes exceeding the above limits.
Min. Dimensions	5 X 5mm	These limits apply to PCBs with thickness ≥ 0.6 mm. Thinner PCBs require manual review. Panelization is recommended for small‑size boards.
Min. Core Thickness	0.05mm	The core thickness for inner layers of these multi‑layer PCBs
Copper Thickness	Inner Layer: 1/4OZ ~ 15OZ	① 1oz: The most common and standard copper thickness in the PCB industry. Suitable for most consumer electronics and general‑purpose signal transmission, balancing performance and cost. ② 2‑6oz: Falls into heavy‑copper category. Mainly used for power modules, motor driver boards, high‑current traces, and power devices requiring good heat dissipation. ③ 7‑15oz: Ultra‑heavy copper. This specification is mostly applied in scenarios with extremely high current or demanding heat‑dissipation requirements, such as electric vehicles and industrial controllers.
Copper Thickness	Outer Layer: 1/2OZ ~ 30OZ	①1/2 oz and even thinner: Mainly used for inner layers of HDI boards, fine signal traces or high‑frequency circuits. ② 1oz (approx. 35 μm): The mainstream choice for inner layers of standard multi‑layer PCBs, applicable to 90% of conventional designs. ③ 30oz: This is an extremely rare extreme copper thickness.If inner layers need to carry extremely high current or serve as extreme heat‑dissipation / conductive layers, the Embedded Copper Coin process or multiple heavy‑copper electroplating is normally adopted instead.
Warpage Degree	Standard: Plated Through-Hole (PTH) board, ≤1.5%; SMT board, ≤0.75%; Limit: Plated Through-Hole(PTH) board, ≤1.0%; SMT board, ≤0.5%	Default settings follow standard specifications. A technical review is required if you need limit‑parameter control. Please specify this clearly when placing your order.
Impedance Tolerance	Standard: <50Ω, ±5Ω； ≥50Ω, ±10%； Limit: <50Ω, ±3.5Ω; ≥50Ω, ±8%	Default settings follow standard specifications. A technical review is required if you need limit‑parameter control. Please specify this clearly when placing your order.
Solder Mask Color	Green, Purple, Red, Yellow, Blue, Cool White, Warm White, High-Reflective White, Black, Matte Black, Matte Green.

Drilling

Item Content	Advanced	Description
Min. Mechanical Drill (CNC)	0.1mm	① For hole size ≥ 6.5 mm, hole tolerance is ±0.1 mm or wider. CNC routing is adopted for holes of 6.5 mm and above. ② Holes ≤ 0.2 mm with an aspect ratio ≥ 10 are classified as medium‑difficulty requirements.
Aspect Ratio(Rate of finished board thickness to min plated hole diameter)	Through-Hole: 20:1 Blind Via: 1:1
Hole Edge to Hole Edge Distance	Same Net: ≥6 MIL Different Net: ≥10 MIL
Average PTH Copper Thickness	1oz: 18μm ≥2oz: 20μm	Production customized per customer selections upon order placement.
Hole Diameter Tolerance	PTH: ±3 MIL (0.075mm) NPTH: ±2 MIL (0.05mm) Press-Fit Hole: ±2 MIL (0.05mm)	Standard press‑fit hole diameter:≤ 2.0 mm. For diameters ＞2.0 mm, standard hole‑size control is preferred.
Hole Position Tolerance	Hole Center to Hole Center within Board: ±0.05MM Hole Center to Board Outline: ±0.1MM	Limit: Hole‑to‑hole center distance (on board): ±0.03 mm
		For mechanical fixture holes, thermal pads or mounting pads. Plating‑related tolerances do not apply.
		①Plated slots: Guarantee reliable electroplating for connector / edge‑component cut‑outs. Well‑designed plated slots lower barrel‑cracking risk in reflow soldering. adopted for holes of 6.5 mm and above. ②Non‑plated slots: Used for isolation breakers & component clearance.
Countersink Hole	Angle (A): Default 90°, tolerance ±10°	Countersink hole: Tapered hole for sinking screw heads below PCB surface to avoid thickness interference from protruding screw heads.
	Diameter (B): 0.5-6.5mm, Through-Hole Diameter (C): ≥0.3mm
	Depth (H): ≥0.1mm, Remaining Thickness ≥0.2mm
	Copper Cutback Safety Distance (d): ≥ ±0.2mm [Requirement of 0.15mm needs review]
Step Hole	Hole Diameter (D): 0.5-1.8mm Hole Diameter (D) Tolerance: ±0.1mm (Limit: ±0.05mm) Depth Control (L) Tolerance: ±0.2mm (Limit: ±0.1mm)	Step hole: Multi‑level hole structure created by stepped‑drilling during PCB manufacturing, critical for precision assembly, signal integrity and space optimization.
Back Drill	Through-Hole Diameter (D): 0.2-0.5mm (Resin filled after back drilling)	Back drill: Key process for multi‑layer PCBs to enhance signal integrity. Secondary drilling removes redundant copper stubs of through‑holes and reduces reflection, scattering and delay for high‑speed signals.
	Back Drill Diameter (W): 0.2mm larger than through-hole drill
	Back Drill Depth (L): Customer specifies target layer, depth tolerance ±0.1mm
	Dielectric Thickness (T): ≥0.15mm (Distance from back drill bottom to nearest inner copper layer)
	Safety Distance (S): ≥0.2mm (Distance from back drill hole edge to adjacent circuit pattern)
	Back Drill Hole to Outer Layer Copper Distance (S2) ≥6 mil (Limit: ≥5 mil)
Castellated Holes	Diameter Range (∅): 0.4-6.35mm (Drilled); ≥6.4mm (Routed)	Castellated holes: Widely adopted for sub‑board assembly of wireless communication and high‑frequency RF modules.
	Half-Hole Edge to Board Outline (L): ≥0.2mm
	Half-Hole Edge to Half-Hole Edge (D): ≥0.5mm
	Half-Hole Process Board Thickness: ≥0.6mm
Edge Plating	Minimum dimension for edge plating process: 10*10 mm	Edge plating means full copper plating followed by immersion gold on board sidewalls (HASL is not available for this process).
	Minimum board thickness for edge plating process: ≥0.6 mm
	For full side-wall edge plating: 3 mm wide copper-free break-away tabs are required (minimum 3 sets; 4 or more sets for larger size boards).
Blind Slot	① Blind Slot Width (W): ≥1.0mm, Size tolerance ±0.13mm	Blind slot: Recessed pockets made by routing. Components or thermal copper blocks are embedded for heat dissipation post‑assembly.
	② Blind Slot Depth (D): ≥0.2mm, Depth tolerance ±0.15mm
	③ Blind Slot Annular Ring (A): ≥0.3mm (Refers to pad width for PTH blind slot)
	④ Safety Distance (S): ≥0.2mm (Distance from NPTH blind slot to adjacent circuit pattern)
	⑤ Blind Slot Remaining Thickness (R): ≥0.2mm (Distance from blind slot bottom to nearest inner copper layer / surface substrate)
	⑥ Supports board thickness (L) ≥0.8mm for 2-32 layer FR4/High-Frequency/High-Speed boards.

Circuit

Item Content	Advanced	Description
Inner Layer Min. trace width and spacing	1/3OZ: 2.7/2.7 MIL
	1/2OZ: 3/3 MIL
	1OZ: regular 3.5/3.5 MIL limit 3/3 MIL
	2OZ: 5/5.5 MIL
	3OZ: 6/7.5 MIL
	4OZ: 7/11.5 MIL
	5OZ: 10/16 MIL
	6OZ: 14/20 MIL	Copper thickness ≥6 oz can be manufactured using a double-sided etching process.
Outer Layer Min. trace width and spacing	1/3OZ: 3/3 MIL
	1/2OZ: 3/3 MIL
	1OZ: regular 4/4 MIL limit 3/3 MIL
	2OZ: regular6/8 MIL limit6/6.3 MIL
	3OZ: regular8/8 MIL limit 6/7.5 MIL
	4OZ: 10/12 MIL
	5OZ: 15/18 MIL
	6OZ: 18/20 MIL	Copper thickness ≥6 oz can be manufactured using a double-sided etching process.
Grid Width (W) and Spacing (L)	1/2OZ, 1OZ: 8*8 MIL	Gaps within the same net that are smaller than the board's minimum trace width must be filled with copper pour. Trace stubs smaller than the minimum trace width should be removed to prevent film lifting.
	2OZ: 10*10 MIL
	3OZ: 12*12 MIL
VIA to Trace (W)	0.2mm
PTH to Trace (H)	0.3mm
NPTH to Trace (S)	0.2mm
Pad to Trace (L)	0.1mm
Different Net SMD Pad Clearance (E)	0.15mm
Coil	1oz Min. Trace Width/Space: 0.15/0.15mm	A special product that directly integrates coil or winding functions onto a printed circuit board (PCB). It is widely used in wireless charging, high‑frequency transformers, Radio‑Frequency Identification (RFID), various sensors and planar motors (e.g. camera OIS optical image stabilization) and other fields.
BGA Pad	① BGA Pad Diameter (D) ≥0.25mm, Limit 0.2mm (price review needed) ② BGA Pad to Trace Clearance (W) ≥0.1mm ③ Via-in-Pad (VIP) with resin plugging + plating&capping is possible for through-holes (d) within BGA pad.	BGA (Ball Grid Array): Widely used in CPU, GPU and high‑end communication chips, featuring high pin density, good electrical and thermal performance.

Solder Mask

Item Content	Advanced	Description
Solder Mask Ink Thickness	On trace surface ≥10μm, at trace corner ≥8μm, on substrate: 20-40μm	Ink thickness above copper surface ≤40μm.
Solder Mask Dam	Green (W) ≥3 MIL; Matte Green, Blue (W) ≥4 MIL; Other colors (W) ≥5 MIL	On Immersion Tin substrate, min. dam (W) 4 MIL (Limit), optimal (W) 5 MIL; On Immersion Tin copper surface, min. dam (W) 6 MIL.
Text Width (formed on the substrate surface by removing the solder mask ink)	HASL Board: On substrate ≥8 MIL; On copper≥12 MIL; ( with solder mask process only once ) On copper≥16 MIL, ≥20 MIL( with twice solder mask porcess )	Text spacing≥20μm. (formed on the substrate surface by removing the solder mask ink)
	Other Surface treatment: On substrate ≥8 MIL; On copper ≥10 MIL; (with solder mask process only once ) On copper ≥14 MIL, ≥18 MIL(with twice solder mask porcess)
Plugged Via	① Hole Diameter (D): 0.15-0.6mm (Only ensures no white light transmission, green light may transmit) ② Vias with tented pads on both sides can be plugged. ③ For double-sided boards with opening on one side and via diameter <0.4mm, only partial plugging possible (may transmit light). ④ If hole partially on opened pad, partial plugging (may transmit light), depends on specific design.	Drill aluminum stencil matching PCB via locations via Laser drilling; press ink into vias with screen printer.
Resin Plug-hole	Plug Hole Diameter (D): 0.15-1.0mm	VIPPO process: Holes fully filled with special thermosetting epoxy via vacuum pressure potting; high‑temp cured, mechanically planarized, followed by surface copper plating. Used for HDI, BGA zones, 5G high‑speed boards and aerospace applications.
	Board Thickness (L): 0.2-8.0mm
	Processing Size: MAX: 660x800mm, MIN: 100x100mm
Copper Paste Filled&Capped	Filled Hole Diameter (D): 0.25-0.5mm	Copper paste filled&capped: Vias filled with conductive copper paste (high‑purity copper powder + organic binder), cured then surface‑plated with copper. Offers outstanding thermal & electrical conductivity for high‑power modules, LED substrates, high‑current industrial boards and NEV motor modules.
	Board Thickness (L): 0.2-8.0mm
	Processing Size: MAX: 610x710mm, MIN: 250x250mm

Legend/Silkscreen

Item Content	Advanced	Description	Pattems
Legend Color	White/Black (Other colors contact customer service)
Min. Line Width (L)	6 mil (0.15mm)
Min. Text Height (H)	40 mil (1.0mm)
Text Width to Height Ratio	1:06
Hollowed Text Width to Height Ratio	1:06
Pad to Legend Clearance	6 mil (0.15mm)
QR Code (A)	10x10mm, 8x8mm, 6x6mm

Carbon Ink, Peelable Blue Mask

Item Content	Advanced	Description
Carbon Ink	Extension beyond covered conductor per side (L): ≥6 mil	Semi‑cured conductive ink: Main ingredients: graphite, carbon powder, resin, hardener. Screen‑printed on target PCB areas; baked & cured to form carbon film for conductive contacts.
	Carbon Ink to Carbon Ink Spacing (H) ≥16 mil
	Carbon Ink to adjacent exposed conductor spacing (W) ≥10 mil
Peelable Blue Mask	Extension beyond covered conductor per side ≥6 mil	One‑component blue viscous insulating ink: Screen‑printed on PCB surface, baked for protection; fully peelable by hand with zero residue after downstream processes.
Peelable Blue Mask	Blue Mask to adjacent exposed conductor spacing ≥16 mil

Profiling

Item Content	Advanced	Description
Routing Profiling	① Trace and pad to board edge distance (S) at routing area: ≥0.2 mm	For precision routing, the single‑piece PCB dimension shall be ≥ 50 × 50 mm. Precision routing requires 3 positioning holes in different orientations with diameter ≥ 1.5 mm. Please select precision routing at order placement if needed. If the design does not support precision routing, standard routing will be applied by default.
	② Trace and pad to routing slot distance (A): ≥0.2 mm
	③ Routing outline tolerance: ±0.2 mm (standard routing), ±0.1 mm (precision routing)
	Minimum routing‑slot width (H) for Aluminum/Copper core PCB: 1.6 mm
Internal Slot Size (PTH)	Routed Slot (H): ≥0.8mm (Standard), Slot Tolerance: ±0.1mm (Routed) ≥0.6mm (Limit), higher cost, price review needed.
V-CUT	① Trace/Pad distance to board edge at V-cut location ≥0.4mm
	② V-cut outline tolerance: ±0.4mm (for board thickness ≥0.6mm)
	③ Default uses zero-clearance panelization (For panels needing V-cut on only two sides, the other two sides can use 1.6mm or 2mm spacing for routing separation).
	④ Min. panel size for V-cut: 70mm. Max. panel size: 1000x1500mm.
	⑤ Distance between adjacent V-cut lines: 3mm (Limit 2mm).
	⑥ Default standard angles: 25°/30°. Other angles require note.
	⑦ Board thickness: 0.4-3.0mm, Remaining thickness accuracy: ±0.1mm.
Breakaway Tab Panelization	① Non-tab area: Trace/Pad distance to board edge (S) ≥0.2mm
	② Non-tab area routing tolerance: ±0.2mm (Standard), ±0.1mm (Precision)
	③ Panel Spacing (L): Default uses 1.6mm or 2mm.
	④Edge Rail Width (W): ≥3mm (Our SMT requires 5mm width, Fiducial (M) 1mm, Tooling Hole (P) 2mm, Fiducial center to board edge (A) 3.85mm)
	⑤ Tab area will have mouse-bite appearance after depanelization.
Gold Finger Beveling	① Bevel Angle (A): 15°-45°, typically 30°	Bevel on gold‑finger tip: Specific‑angle bevel facilitates smooth PCB insertion into female socket; avoids scratching socket metal springs and plating peeling during mating cycles.
	② Bevel Angle Tolerance: ±5°
	③ Board Thickness for Beveling (L): 0.8-2.4mm
	④ Bevel Remaining Thickness & Tolerance: ±0.15mm
	⑤ Beveling Dimensions: Min. 50x80mm, Max. 500x200mm

Surface Finish

Item Content	Advanced	Description
HASL (Lead/Lead-Free)	Standard Tin Thickness (D): 1-40μm	Min. Pad Diameter for HASL with Lead: 0.25mm Min. Pad Diameter for HASL Lead-Free: 0.28mm
	Board Thickness (L): 0.3-5.4mm
	Processing Size: Max. 1300x400mm (Single-sided), 650x560mm (Double-sided/Multilayer), Min.: 50x50mm
OSP	Organic Film Thickness: 0.20-0.60μm
	Board Thickness: 0.4-5.0mm
	Processing Size: Min. 80x80mm
ENIG	Standard Thickness: Nickel 120~300μ" (adjustable per request), Gold 1~5μ"
	Board Thickness: 0.2mm-4.5mm
	Processing Size: Min. 100x100mm (Prototype 50x50mm); Max. 600x1200mm
Immersion Tin	Standard Tin Thickness: 1.0-1.3μm
	Board Thickness: 0.3-4.0mm
	Processing Size: Min. 100x150mm (100x100mm), Max. short side <610mm
Immersion Silver	Standard Silver Thickness: 0.15-0.40μm
	Board Thickness: 0.4mm-4.0mm
	Processing Size: Min. 100x100mm (Long side ≥100mm, Short side ≥60mm), Max. short side <610mm
ENEPIG	Standard Thickness: Nickel 120~300μ" (adjustable), Palladium 1~2μ" (Max 20μ"), Gold 1~5μ"
	Board Thickness: 0.3mm-4.0mm
	Processing Size: Min. 200x200mm; Max. 600x900mm
Gold Plating	Standard Thickness: Nickel 80-300μ", Gold 1-80μ"
	Board Thickness: 0.6mm-4.0mm
	Processing Size: 600x600mm (One side can exceed 600mm), Min. 200x100mm