• Product Feature Requirements Technology Category Technical Items Technical Capacity Indicators
    High-frequency Special Material Adoption Non-PTFE Ceramic / Hydrocarbon High-frequency Material Technology ① Research on material electrical properties; ② Research on material reliability and physicochemical properties; ③ Research on material machinability; ④ Research on material design performance Comprehensive understanding and research of materials to guide design and manufacturing
    PTFE High-frequency Material Technology
    High Appearance Standards Appearance Quality ① Burrs, debris, delamination, halo, notches, exposed fabric, weave pattern, pits, white spots, residual adhesive
    ② Scratches, indentations, pinholes, circuit damage, metal debris, dimples, color difference, grains, roughness, exposed copper    		 Compliant with IPC-6018C and GJB Microwave Printed Board General Specification
    Nickel-free Thick Gold or Mixed Surface Finish Surface Finish Technology ① Application of nickel-free thick gold process
    ② Process development for soft gold + thick gold, immersion gold + thick gold, OSP + thick gold     		Gold thickness: 0.05~4μm
    High Alignment Accuracy Layer-to-layer Pattern Registration ① LDI laser exposure technology; ② Establishment and optimization of material shrinkage & expansion control system Pattern center layer offset ≤1mil
    Alignment of Holes, Slots, Edges and Patterns ① Layer pressing PIN-LAM system; ② X-RAY target drilling technology; ③ CCD alignment drilling & milling technology; ④ Laser cutting technology ① Hole position tolerance ±1mil; ② Drilling misalignment ≤1.5mil; ③ Alignment accuracy between specified objects ≤2mil
    Slot / Step Structure Technology Slot Structure ① Fully metallized / non-metallized blind slot technology; ② Partially metallized + stepped slot technology ① Squeeze-out ≤0.5mm; ② Slot dimension ≥0.5*0.5mm; ③ Slot depth ≥0.05mm; ④ Slot tolerance ±0.05mm; ⑤ Max. 3 steps
    Step Structure ① Fully metallized / non-metallized step technology; ② Sectionally metallized step technology
    Other PCB Technologies Mixed lamination / HDI / Blind & Buried Vias / Embedded Copper Blocks / Metal Core Mixed lamination technology, HDI technology, blind & buried via technology, embedded copper block technology, metal core technology Meet corresponding technical specifications
    Embedded Resistors & Capacitors / Embedded Components ① Embedded resistor & capacitor technology; ② Embedded component technology ① Resistance / capacitance tolerance ±15%
    ② Supports embedded IC, resistors and capacitors
  • Core Technology Technical Indicators Mature Capacity R&D Capacity
    Material Processable Materials FR-4, PTFE, Non-PTFE, PI, etc. FR-4, PTFE, Non-PTFE, PI, etc.
    Board Thickness Capability Max Board Thickness / mm 8.0 10
    Max Layers 30 30+
    Dimension Capability Max & Min Machining Size / mm Min: 1*1; Max: 570*670 Min: 1*1; Max: 570*1200
    Dimensional Accuracy Outline Tolerance / mm ±0.075 ±0.05
    Slot Fabrication Capability Slot Dimension Tolerance / mm ±0.075 ±0.05
    Layer-to-layer Alignment Min Distance from Hole to Conductor / mil 5 4
    Hole Machining Technology Min Hole Diameter / mil Mechanical 6mil, Laser 2.5mil Mechanical 5mil, Laser 2mil
    Min BGA Pitch / mm 0.4 0.35
    Min Wall Spacing / mm 0.18 0.15
    Hole Diameter Tolerance / mil ±2.0 (PTH)
    ±1.0 (NPTH)    		 ±2.0 (PTH)
    ±1.0 (NPTH)
    Hole Position Tolerance / mil ±2 ±2
    Electroplating Aspect Ratio 20:1 30:1
    Line Width Fabrication Line Width Tolerance / um ±20 ±15
    Impedance Control Impedance Tolerance /% (≥50Ω) ±8% ±7%
    Flatness Control Warpage /% 0.75% 0.5%
  • High Tg High Speed High Freq (Non-PTFE) PTFE PI Metal Substrate High Thermal Conductivity
    IT180A TU-872SLK/TU872SLK-SP RO4350B TLX, TLY Series 85N T110 T112(B/C)
    S1190 R-5725/R-5725S RO4730G3 AD, RT Series VT-901 T111 VT-4(B3/B5)
    S1000-2 R-5775G RO4725JXR TMM Series SH260 VT-4A1 1KA04
    S1000-2M IT-968 RO4533 RO3000 Series / VT-4A2 1KA06
    TU-862 HF R-5785N RO4835 TC Series / 92MCL 1KA08
    TU-752/768 Meteor wave 4000 RO4003C CLTE, TSM Series / / T512
    185HR IT-988G SE Domestic Equivalent Series Domestic Equivalent Series / / /

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