1.0https://www.cezonpcb.com/zhcezonpcbhttps://www.cezonpcb.com/zh/author/cezonpcb/rich600338<blockquote class="wp-embedded-content" data-secret="UlT0C4FG2W"><a href="https://www.cezonpcb.com/zh/product/aluminum-pcb/">铝基板</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://www.cezonpcb.com/zh/product/aluminum-pcb/embed/#?secret=UlT0C4FG2W" width="600" height="338" title="《 Aluminum PCB 》—" data-secret="UlT0C4FG2W" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script> /*! This file is auto-generated */ !function(d,l){"use strict";l.querySelector&&d.addEventListener&&"undefined"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!/[^a-zA-Z0-9]/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret="'+t.secret+'"]'),o=l.querySelectorAll('blockquote[data-secret="'+t.secret+'"]'),c=new RegExp("^https?:$","i"),i=0;i<o.length;i++)o[i].style.display="none";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute("style"),"height"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):"link"===t.message&&(r=new URL(s.getAttribute("src")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener("message",d.wp.receiveEmbedMessage,!1),l.addEventListener("DOMContentLoaded",function(){for(var e,t,s=l.querySelectorAll("iframe.wp-embedded-content"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute("data-secret"))||(t=Math.random().toString(36).substring(2,12),e.src+="#?secret="+t,e.setAttribute("data-secret",t)),e.contentWindow.postMessage({message:"ready",secret:t},"*")},!1)))}(window,document); //# sourceURL=https://www.cezonpcb.com/wp-includes/js/wp-embed.min.js </script>https://www.cezonpcb.com/wp-content/uploads/2026/10/Special-Copper-Clad-Laminate-GM-CU-Series.webp530272Aluminum PCB is a cost-effective heat dissipation circuit board constructed with high-purity aluminum (≥99.6%) as the thermal substrate, combined with low thermal resistance insulating media (thermal silicone gel, aluminum oxide ceramics, or modified epoxy resin) and conductive copper foil. Through an integrated design featuring rapid heat conduction via the aluminum core layer and electrical isolation via the insulating layer, it effectively addresses heat dissipation challenges for medium-power devices. It serves as the mainstream thermal substrate in fields such as LED lighting, power electronics, and automotive electronics.